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Snapdragon 780G to be upgraded with SD888 layer connectivity-Techweu

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The demand for flagship chipsets that don’t pay the full price of the Snapdragon 888 is huge, and Qualcomm is reportedly working on a new platform that borrows connectivity modules without overusing the CPU.

This chip, called the Snapdragon 780G, introduces ultra-fast Wi-Fi 6e speed and FastConnect 6900 integrated mobile connectivity system for Bluetooth 5.2. According to leakster, the chip will also include a new Snapdragon X535G modem with a maximum DL speed of 3.3 Gbps.

Snapdragon 780G to be upgraded with SD888 layer connectivity-Techweu

Nothing is said about the CPU or GPU of this platform. Some specs look similar to the rumoured Snapdragon 775 / 775G platform, but it’s not surprising that Qualcomm redesigned the 780 to a slightly overclocked version of the 775.

Snapdragon 780G to be upgraded with SD888 layer connectivity-Techweu

Chip companies in San Diego are struggling to provide chips to all their customers due to bottleneck issues in Samsung and TSMC-owned factories. This means that smartphones with the Snapdragon 780G will be available as early as the second quarter of 2021. This is still a pretty confident timeline if you can trust Leak Star.

Source (Chinese) | via

Shweta
Shweta loves online shopping & she is an enthusiastic writer who is interested in technology, Shweta is an author in techweu community she writes about internet She sleeps and wakes with her mobile phone, data connection on 24/7.

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