The demand for flagship chipsets that don’t pay the full price of the Snapdragon 888 is huge, and Qualcomm is reportedly working on a new platform that borrows connectivity modules without overusing the CPU.
This chip, called the Snapdragon 780G, introduces ultra-fast Wi-Fi 6e speed and FastConnect 6900 integrated mobile connectivity system for Bluetooth 5.2. According to leakster, the chip will also include a new Snapdragon X535G modem with a maximum DL speed of 3.3 Gbps.
Nothing is said about the CPU or GPU of this platform. Some specs look similar to the rumoured Snapdragon 775 / 775G platform, but it’s not surprising that Qualcomm redesigned the 780 to a slightly overclocked version of the 775.
Chip companies in San Diego are struggling to provide chips to all their customers due to bottleneck issues in Samsung and TSMC-owned factories. This means that smartphones with the Snapdragon 780G will be available as early as the second quarter of 2021. This is still a pretty confident timeline if you can trust Leak Star.