The first phone with the Snapdragon 888 chipset has already been officially announced with the launch of Xiaomi’s Mi 11 in China yesterday. The brand new Xiaomi flagship quickly gave way to local tech bloggers and disassembly experts Aiao Technology I decided to disassemble it to show what the inside looks like.
As with any disassembly, this begins by removing the SIM tray at the bottom near the USB-C port. Next, pry open the plastic eco-leather to remove all the glue and remove the few screws that secure the camera sensor cover. The main 108MP sensor is Samsung’s ISOCELL HMX that comes with OIS, paired with the 5MP Samsung S5K5E9, but the 13MP ultra-wide module is OmniVision’s CMOS OV13B10.
The motherboard has a lot of copper foil on the front and back, and also has some heatsinks to improve thermal performance. After removing the copper bit, you can actually see the brand new Snapdragon 888 chipset along with the flash memory, both firmly glued in case of exposure to liquid. The 4,600 mAh battery is courtesy of Sunwoda Electronics Co Ltd.