Lenovo is introducing a Legion Y70 smartphone on August 18, and the company already revealed major specs of the new flagship. Today it continued with an array of teasers, revealing more about the phone’s cooling capabilities.
The company is going to introduce a massive 5,047 sq.mm VC cooling that’s just 0.55 mm thick. That’s right, the chamber will have a profile that’s half a millimeter.
Lenovo Legion Y70 is going to have an extremely thin profile in general – advertised is 7.99 mm, which is the base thickness without the protruding 50MP camera with OIS.
It will somehow manage to bring 10 layers of heat dissipating materials and solutions, and the phone is being advertised next to a fridge because obvious references are obvious.
As we can see, the new Legion smartphone wants to keep the gaming legacy of the sub-brand while keeping a friendlier look and feeling for the average consumer.
There will be no shoulder triggers or heavily modified UI for mobile gaming-oriented users but is still expected to keep the top performance with a Snapdragon 8+ Gen 1, 68W fast charging and up to 16 GB RAM.
Source (in Chinese)